5.0mm 0.197in Dip Wafer Car Seat Control Connector BCM

The 5.0 mm (0.197 in) DIP Wafer Connector is designed to provide a stable and reliable board-to-wire connection for power and signal transmission in industrial and commercial applications. Featuring a dual in-line pin (DIP) structure, this connector allows secure through-hole mounting, ensuring excellent mechanical strength and solder retention during assembly and long-term operation.

With a 5.0 mm pitch, the connector supports higher current capacity while maintaining compact spacing, making it ideal for power control modules, motor drives, power supplies, and industrial automation equipment. The wafer housing is manufactured from high-temperature, flame-retardant thermoplastic, offering strong resistance to heat, vibration, and environmental stress.

Key Features

• 0.197" (5.0mm) pitch for standard PCB layouts
• .020" (0.5mm）square post contact system  mm) square post contact system
• Vertical and right-angle orientations available
• Fully automated production for consistent quality
• 100% CCD visual inspection to ensure defect-free products
• Multiple plating options to enhance durability and conductivity