1.50mm 0.059 inch Pitch Wafer Socket Horizontal DIP for industrial automation
1.50mm 0.059 inch Pitch Wafer Socket Horizontal DIP for industrial automation
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-20Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The 1.50mm Pitch Wafer Connector series is a high-reliability interconnect solution engineered for stable power and signal distribution in industrial automation, automotive electronics, and smart home appliances. These headers are available in versatile Surface Mount (SMT) and Through-Hole (DIP) mounting styles to support diverse manufacturing requirements, including automated reflow and wave soldering processes. Designed with a polarized, shrouded housing, they provide excellent pin protection and ensure error-free mating in complex control boards and battery management systems. The robust 2.50mm pitch offers enhanced mechanical stability and insulation, making it ideal for vibration-prone environments.
Key Features
- 1.50mm (0.059'') pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
