1.50mm 0.059 Pitch Wafer Socket Right Angle DIP for LED Backlight Power connect

1.50mm 0.059 Pitch Wafer Socket Right Angle DIP for LED Backlight Power connect

1.50mm 0.059 Pitch Wafer Socket Right Angle DIP for LED Backlight Power connect

Product Specifications

Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-16Pin
OrientationVertical
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional

Product Description

The 1.50mm Pitch Right Angle DIP Wafer Connector is a high-performance through-hole interconnect solution designed for applications requiring a balance between compact size and extreme mechanical robustness. Featuring a precise 1.50mm (0.059") pitch, this horizontal DIP header is specifically engineered for automotive electronics, industrial control systems, and modern home appliances where board-to-wire connections must withstand vibration and thermal stress. The side-entry design allows wire harnesses to be connected parallel to the PCB, effectively reducing the overall vertical profile of the assembly in slim-line LED displays and medical monitoring equipment. With its through-hole pins providing a secure physical bond to the circuit board, this connector ensures long-term signal integrity in mission-critical hardware.

Key Features

  • 0.059" (1.5mm) pitch for standard PCB layouts
  • Customize pins, pitch,height,length
  • Compliance with REACH, ISO, RoHS
  • High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
  • Fully automated production for consistent quality
  • 100% CCD visual inspection to ensure defect-free products
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