Vertical Male Header 5188835-1 for CompactPCI Racks, Telecom Backplanes, and Mezzanine Board Stacking

Vertical Male Header 5188835-1 for CompactPCI Racks, Telecom Backplanes, and Mezzanine Board Stacking

Vertical Male Header 5188835-1 for CompactPCI Racks, Telecom Backplanes, and Mezzanine Board Stacking

Product Specifications

Position Count154
Centerline Pitch2.00mm [.078 in]
Contact MaterialCopper Alloy
Contact FinishSelective
Impedance100-Ohm
Cross Reference5188835-1

Product Description

The 154-Position Vertical Male Header Connector is a high-density IEC 61076-4-101-compliant interconnect engineered as a direct drop-in replacement for TE Connectivity P/N 5188835-1. Designed to support both standard vertical backplane bus architectures and high-density mezzanine board-to-board stacking, this 7-row hard metric header provides low-noise, reliable power and signal interconnectivity.

PCB Mounting & Mating Setup: Featuring solderless press-fit (compliant pin) termination onto multi-layer motherboards, this connector avoids thermal damage during PCB processing while delivering exceptional mechanical retention. It mates directly with standard 2mm HM Type B 154-position right-angle female receptacles on daughtercards or parallel mezzanine boards.

Primary Application Scenarios: Built for demanding industrial and telecommunications computing standards, this connector is widely deployed in CompactPCI (cPCI) industrial chassis, 3U/6U VPX expansion racks, telecom transmission equipment, power grid automation controllers, and avionics instrumentation.

Key Features

  • 5188835-1 Equivalent: Cost-effective drop-in replacement cuts procurement costs for CompactPCI system integration.
  • 154-Pos Type B Grid: 7-row 22-column array provides dense multi-signal routing for telecom control motherboards.
  • Versatile Mezzanine Stacking: Vertical pin alignment enables parallel board-to-board stacking in compact 3U/6U chassis.
  • Press-Fit Action Pins for PCBs: Solderless compliant pin design simplifies repair and assembly on thick backplane boards.
  • Industrial Temperature Resilience: Operates smoothly from -55°C to +125°C in harsh power grid and defense computing environments.
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