2.50mm 0.098 inch Vertical DIP Right Angle Wafer Socket for Drone Electronic Interconnect

2.50mm 0.098 inch Vertical DIP Right Angle Wafer Socket for Drone Electronic Interconnect

2.50mm 0.098 inch Vertical DIP Right Angle Wafer Socket for Drone Electronic Interconnect

Product Specifications

Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-20Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin
Insulator HighOptional

Product Description

YYE 2.50mm Pitch Wafer Connector is a high-reliability interconnect solution specifically designed for PLC (Programmable Logic Controller) expansion modules and Industrial I/O systems. In compact DIN-rail control environments, these headers provide a secure wire-to-board interface for critical signal transmission and power distribution. Featuring both vertical and horizontal configurations, they allow engineers to optimize PCB layout efficiency within narrow industrial enclosures. The polarized friction-lock design ensures stable mating under high-vibration conditions, making them ideal for OEM/ODM manufacturers of automated control systems.

Key Features

  • 0.098" (2.5mm) pitch for standard PCB layouts
  • Customize pins, pitch,height,length
  • Compliance with REACH, ISO, RoHS
  • High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
  • Fully automated production for consistent quality
  • 100% CCD visual inspection to ensure defect-free products
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