2.50mm 0.098 inch Horizontal DIP Wafer Socket for automotive electronic systems
2.50mm 0.098 inch Horizontal DIP Wafer Socket for automotive electronic systems
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-15Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The 2.50mm Pitch Wafer Connector series is a high-reliability interconnect solution designed for power and signal distribution in demanding industrial automation and automotive electronic systems. Featuring both SMT and Through-Hole (DIP) configurations, these headers offer the mechanical stability required for heavy-duty appliances and power supply modules. The 2.50mm pitch provides superior insulation and current-handling capabilities compared to smaller pitches, making it an ideal choice for battery management systems and motor controllers. Built with high-temperature resistant materials, this series is fully compatible with modern lead-free reflow and wave soldering manufacturing environments.
Key Features
- 0.098" (2.5mm) pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
Related Products
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2.50mm 0.098 inch Pitch Horizontal DIP Wafer Socekt for BMS (Battery Management System) Link
