2.00mm 0.079 inch Pitch Horizontal DIP Dual Row Wafer Socekt for Automotive ECU
2.00mm 0.079 inch Pitch Horizontal DIP Dual Row Wafer Socekt for Automotive ECU
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions4-60Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The 2.00mm Pitch Wafer Connector series is a high-performance wire-to-board solution engineered for high-density PCB layouts across industrial, automotive, and consumer electronics. These headers are available in versatile SMT and Through-Hole (DIP) configurations to support diverse manufacturing processes, including automated reflow and wave soldering. Designed with a polarized, shrouded housing, they provide excellent pin protection and prevent accidental mismating in complex control boards and power supply modules. Whether you require a vertical orientation for space-saving or a right-angle design for low-profile applications, this 2.0mm series ensures reliable signal and power transmission in vibration-prone environments.
Key Features
- 0.079" (2.0mm) pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
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