Ultra-Thin 1.25mm 0.049 inch Wafer Socket Side Entry Horizontal SMD for slim-line handheld devices
Ultra-Thin 1.25mm 0.049 inch Wafer Socket Side Entry Horizontal SMD for slim-line handheld devices
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-30Pin
OrientationVertical
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The 1.25mm Pitch Right Angle SMT Wafer Connector is an ultra-compact wire-to-board solution designed for high-density PCB layouts where vertical space is strictly limited. Featuring a specialized 1.25mm (0.049") pitch and a low-profile horizontal design, this wafer header is ideal for smartphones, wearable health monitors, and compact IoT sensors. The side-entry SMT architecture allows for efficient wire routing parallel to the PCB, minimizing vertical clearance in slim-line handheld devices and medical instruments. Constructed with high-temperature, flame-retardant materials and premium gold-plated contacts, it ensures long-term signal integrity and reliability for industrial automation and consumer hardware.
Key Features
- 0.049" (1.25mm) pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
