1.00mm 0.039 inch Pitch Vertical SMD Wafer Socket for for Slim Electronics

The 1.00mm Pitch Ultra-Thin SMT Wafer Connector is an elite interconnect solution designed for the next generation of compact, slim-line electronics. Featuring a miniature 1.0mm pitch and an exceptionally low-profile horizontal design, this wafer header is the ideal choice for high-density mobile devices, ultra-thin laptops, and sophisticated medical sensors where vertical space is strictly limited. The surface-mount architecture combined with reinforced metal solder tabs ensures maximum mechanical stability during high-speed automated assembly. Engineered with high-temperature resistant materials, it reliably supports lead-free reflow soldering for mission-critical IoT and wearable technology hardware.

Key Features

• 0.039" (1.00mm) pitch for standard PCB layouts
• Customize pins, pitch,height,length
• Compliance with REACH, ISO, RoHS
• High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
• Fully automated production for consistent quality
• 100% CCD visual inspection to ensure defect-free products