0.8mm 0.031in 100P Board to Board Connector for Industrial Control Systems

The 0.8mm (0.031in) High-Density Board to Board Connector is designed to meet the growing demand for compact, high-performance electronic interconnections. With a fine 0.8mm pitch, this connector enables higher signal density while efficiently reducing PCB space, making it an ideal solution for miniaturized electronic designs. It is widely used in applications such as industrial automation, consumer electronics, medical equipment, and communication systems.

This 0.031in board to board connector features precision-stamped contacts and a high-temperature thermoplastic housing that supports SMT reflow soldering processes. The robust contact design ensures stable electrical performance, low contact resistance, and reliable signal transmission, even under vibration or thermal cycling. Multiple pin counts and stack height options provide design flexibility for parallel PCB connections.

Gold-plated terminals enhance conductivity and corrosion resistance, ensuring long-term durability and consistent mating performance. The high-density board to board connector offers excellent alignment accuracy and mechanical strength, supporting high-speed signal integrity and reliable board stacking. With its compact footprint, strong reliability, and cost-effective design, the 0.8mm board to board connector is an optimal interconnection solution for modern high-density electronic products.

Key Features

• 0.031" (0.8mm) pitch for standard PCB layouts
• .006" (0.15mm）square post contact system  mm) square post contact system
• Vertical and right-angle orientations available
• Fully automated production for consistent quality
• 100% CCD visual inspection to ensure defect-free products
• Multiple plating options to enhance durability and conductivity