Right-Angle Backplane CB Mount Receptacle 5120794-1 for Telecom Daughtercards, Enterprise Servers, and Industrial Backplanes

Right-Angle Backplane CB Mount Receptacle 5120794-1 for Telecom Daughtercards, Enterprise Servers, and Industrial Backplanes

Right-Angle Backplane CB Mount Receptacle 5120794-1 for Telecom Daughtercards, Enterprise Servers, and Industrial Backplanes

Product Specifications

Position Count50 Positions
Centerline Pitch2.00mm [.079 in]
Contact MaterialCopper Alloy
Contact FinishSelective
Impedance100-Ohm
Cross Reference5120794-1

Product Description

The Z-PACK HS3 50-Position Right-Angle Backplane Receptacle Connector is a high-density, 2mm-pitch interconnect engineered as a direct pin-to-pin replacement for TE Connectivity P/N 5120794-1. Designed for robust signal integrity in high-speed system architectures, this female receptacle establishes a reliable 90-degree interface between daughtercards and backplane motherboards.

PCB Mounting & Mating Setup: Featuring solderless press-fit (compliant pin) terminations onto rigid multi-layer PCBs, this right-angle receptacle simplifies card edge assembly while maintaining low insertion forces. It mates directly with standard Z-PACK HS3 backplane pin headers, providing polarized alignment to prevent accidental mis-mating during card insertion.

Primary Application Scenarios: Built for demanding computing and networking hardware, this connector is widely deployed in telecom central office routers, 5G baseband units, enterprise server daughtercards, network switches, and modular industrial computing chassis.

Key Features

  • 5120794-1 Equivalent: Cost-effective drop-in replacement reduces BOM expenses for telecom card manufacturers.
  • 50-Pos High-Density Grid: 10-row compact layout maximizes signal density on space-constrained daughtercards.
  • Polarized Alignment for Rack Systems: Built-in polarization keying prevents pin damage during server board blind-mating.
  • Press-Fit Termination for Multi-Layer PCBs: Solderless compliant pins eliminate thermal stress on thick backplane daughtercards.
  • Gold-Plated Contacts for Data Centers: Heavy gold plating protects signal paths against oxidation in non-stop operating servers.
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