2.00mm 0.079 inch Horizontal DIP With K Wafer Socket for Power Supply Module Link
2.00mm 0.079 inch Horizontal DIP With K Wafer Socket for Power Supply Module Link
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-15Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The 2.00mm Pitch Wafer Connector series is engineered to provide high-reliability wire-to-board interconnects for demanding industrial and consumer applications. Available in both Surface Mount (SMT) and Through-Hole (DIP) mounting styles, these 2.50mm (0.079") headers are a preferred choice for industrial automation controllers, automotive power modules, and large household appliances. The wider pitch ensures excellent insulation and current-carrying capacity, making it perfect for power supply interfaces and motor control systems where mechanical stability is critical. With heat-resistant housing materials, this series is fully compatible with standard reflow and wave soldering processes.
Key Features
- 0.079" (2.0mm) pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
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