Inkqubo ye-Electroplating crystallization

Inkqubo ye-Electroplating crystallization

I-1.Ngaphantsi kweemeko ezithile, ukuphakama kwangoku, ifilimu yokugqoka i-coating, i-current single ifikelela kumda othile, kwaye ukuhlambalaza kwefilimu akuyi kunyuka ngokunyuka kwangoku.

2. Ngaphantsi kweemeko ezifanayo, ukuphakama kwangoku, i-electroplating crystal particles enkulu, i-degree ye-pinhole enkulu, kunye nokuxhatshazwa kwe-corrosion embi.

3.Kumda we-electroplating yangoku, ukwambathisa kungekuphela nje amasuntswana ekristale, kunye nolungiselelo lwamasuntswana ekristale ngokungaqhelekanga, ukuqaqamba, imeko embi ye-SEM, i-LLR, uvavanyo lwe-BAKE lunempembelelo.

i-anode kunye ne-cathode ye-DC power supply idityaniswe kwi-cathode ye-aqueduct, i-anion kwisisombululo se-electroplating ilahlekelwa ii-electron kwi-oxidation reaction kwi-anode, kwaye i-cation izuza ii-electron zokunciphisa ukusabela kwi-cathode.

Inkqubo ye-Electroplating

Xa electroplating, iziqwenga zesinyithi njengoko cathode, igolide ecakwe okanye ingxubevange njengoko anode, ngokulandelelana eqhagamshelwe electrode conductive elungileyo, kwaye untywiliselwe isisombululo electrolytic equlathe amacandelo ukutyabeka, kwaye ke ngokusebenzisa ngqo langoku.

Izinto ezintathu ze-electroplating

Dc unikezelo lwamandla

I-electrode yeYin kunye neYang

I-Electrolyte equlethe ii-ion ezenzelwe ukubekwa kwegolide