Low profile box header 1.27mm 0.050inch pitch IDC male header for aerospace telemetry modules

Low profile box header 1.27mm 0.050inch pitch IDC male header for aerospace telemetry modules

Low profile box header 1.27mm 0.050inch pitch IDC male header for aerospace telemetry modules

Product Specifications

Rated Current3.0A AC/DC
Insulator Resist ance5000 Megohms Min
Dielectric Withs tandingAC 1000 V
No. of Positions4-100PIN
OrientationVertical
Contact MaterialCopper Alloy
Insulator MaterialOptional:PA6T;PA9T
Flame RatingUL 94V-0
Plating OptionTin;Gold
Insulator High9.5mm

Product Description

The 1.27mm Pitch Dual Row SMD Box Header, with a vertical height of 9.5mm, serves as a high-performance interconnect solution designed for modern, miniaturized electronic systems. Featuring a fully shrouded "box" housing and a precision polarization slot, this component not only safeguards delicate contact pins from mechanical damage but also ensures error-proof mating with IDC ribbon cable assemblies. Its surface-mount (SMT) tails are engineered for optimal coplanarity, ensuring reliable reflow soldering in automated high-speed assembly processes.

This header is particularly well-suited for applications in Aerospace, Medical Devices, and Compact Industrial Computing, where both space optimization and signal integrity are critical. The design enhances durability and performance in environments that demand precision and reliability, making it a trusted choice for industries requiring advanced, compact interconnect solutions.

Key Features

  • 0.050" (1.27mm) pitch for standard PCB layouts
  • Customize pins, pitch,height,length
  • Compliance with REACH, ISO, RoHS
  • High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
  • Fully automated production for consistent quality
  • 100% CCD visual inspection to ensure defect-free products
Contact us via Teams