3.00mm 0.118 inch Pitch Horizontal DIP Dual Row for Telecommunications Backplane
3.00mm 0.118 inch Pitch Horizontal DIP Dual Row for Telecommunications Backplane
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions2-24Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The Micro-Fit 3.0mm Pitch Wafer Connector series is a compact, high-current interconnect solution designed for high-density power and signal distribution. These connectors are engineered for reliability in medical devices, solar energy systems, and industrial automation where space is limited but performance is critical. Featuring a fully shrouded design and polarized housing, these headers prevent mismating and protect contact pins during handling. Whether using Through-Hole (DIP) for maximum board retention or SMT for automated high-volume production, this series provides a stable, low-resistance interface for your PCB assembly.
Key Features
- 3.00mm (0.118'') pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
