2.00mm 0.079 inch Pitch Horizontal DIP & Vertical Rihht Angle Wafer Socket for automotive dashboards
2.00mm 0.079 inch Pitch Horizontal DIP & Vertical Rihht Angle Wafer Socket for automotive dashboards
Product Specifications
Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions8-40Pin
OrientationHorizontal
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional
Product Description
The 2.00mm Pitch Wafer Connector series is a high-reliability wire-to-board solution designed for versatile PCB integration. Featuring both Surface Mount (SMT) and Through-Hole (DIP) configurations, these headers provide a stable interface for automotive dashboards, industrial sensors, and household control boards. The 2.00mm pitch offers an ideal balance of space-saving miniaturization and robust current-carrying capacity, making it perfect for slim-line LED panels and compact medical devices. Fully compatible with automated reflow or wave soldering processes, the heat-resistant shrouded housing ensures long-term mechanical reliability in vibration-prone environments.
Key Features
- 0.079" (2.0mm) pitch for standard PCB layouts
- Customize pins, pitch,height,length
- Compliance with REACH, ISO, RoHS
- High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
- Fully automated production for consistent quality
- 100% CCD visual inspection to ensure defect-free products
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