Shrouded 1.00mm 0.039 inch Pitch Vertical SMD Side Entry Wafer Socket for Thin-Film Transistor (TFT) Displays

Shrouded 1.00mm 0.039 inch Pitch Vertical SMD Side Entry Wafer Socket for Thin-Film Transistor (TFT) Displays

Shrouded 1.00mm 0.039 inch Pitch Vertical SMD Side Entry Wafer Socket for Thin-Film Transistor (TFT) Displays

Product Specifications

Current Rating3 Amp
Insulator Resistance5000 Megohms Min
Dielectric WithstandingAC 1000 V
No. of Positions20;30;40;50 Pin
OrientationVertical
Contact MaterialCopper Alloy
Insulator MaterialOptional: PBT,PA6T,PA9
Flame RatingUL 94V-0
Plating OptionTin, Gold,
Insulator HighOptional

Product Description

The 1.00mm Pitch SMT Wafer Connector is an ultra-compact wire-to-board solution designed for high-density electronic assemblies where space is at a premium. Featuring a miniature 0.039" pitch, this wafer header is ideal for smartphones, wearable health monitors, and compact IoT sensors. The SMT (Surface Mount Technology) design, combined with robust solder tabs, ensures a secure mechanical bond to the PCB even in vibration-prone environments like drones or automotive electronics. With high-temperature plastic housing, it is fully compatible with lead-free reflow soldering processes, making it the preferred choice for modern consumer and industrial electronics manufacturing.

Key Features

  • Miniature Footprint: The 1.00mm pitch design significantly reduces PCB space requirements for portable and handheld devices.
  • SMT Compatibility: Designed for automated pick-and-place assembly, improving production efficiency for high-volume consumer hardware.
  • Secure Shrouded Design: Protects pins from damage during handling and ensures correct polarization when mating with wire-to-board housings.
  • High Signal Integrity: Precision-engineered contacts provide reliable electrical performance for high-speed signal and data transmission.
  • Durable Solder Tabs: Includes metal solder tabs to provide additional strain relief and prevent the connector from lifting off the board in robotic and handheld applications.
Contact us via Teams